System on Module (SoM)

Discover the possibilities

SoMs combine microprocessor (CPU), flash, RAM and power supply on a compact printed circuit board. The multitude of communication interfaces are connected via contact pads on the edge and underside of the module. The SoM modules are soldered onto the corresponding carrier boards so that no additional connectors are required. Thus, they represent a powerful core module for creating individual applications.

 

  • Short development cycle

    Take advantage of the head start and get your product on the market faster

     

  • Reduced engineering risks

    Shorter development times and lower costs thanks to tried-and-tested solutions

     

  • Easy to use

    Fully developed CPU core can be used like a microcontroller

     

  • EMC already tested

    Decoupling capacitors and impedance-controlled lines are in place

     

  • Complex PIN multiplexing and DDR3/DDR4 RAM Design

    These costly and sophisticated features have already been implemented

     

  • Long-term availability of CPU module

    Meets the high requirements for computing power and free configuration of a variety of interfaces

     

  • Lifecycle Management

    Professional support to maintain a long product life cycle

     

  • FAQ

    Frequently Asked Questions

     

OSM-S i.MX8M Plus

OSM-S i.MX8M Plus

Open Standard Module™ (OSM) 2x GbE-LAN and TSN functionality an just  30 mm x 30 mm

  • NXP i.MX8M Plus, 4 x Arm® Cortex®-A53 @1.6 GHz
  • 1 x Arm® Cortex®-M7 @800 MHz
  • 1 GB up to 4 GB LPDDR4-RAM
  • Form factor 30 mm x 30 mm, OSM-Size-S

Request a quote

Accessories

  • Board
  • Evaluation Kit

Software

  • Embedded Linux (Yocto Distribution) 

Technical Data

FunctionStandardOptions
Microprocessor
CPUNXP i.MX8M Plus, 4x Arm® Cortex®-A53 @1.6 GHz, 1x Arm® Cortex®-M7 @800 MHz, 2D GPU and 3D GPU
Memory
LPDDR4-RAM4 GB1 GB, 2 GB
eMMC32 GB4 GB up to 64 GB
EEPROM8 kB Up to 128 kb
Communication
Ethernet2x 1 Gbit/s IEEE 1588 (1x with TSN)
USB2x 3.0
I/O4x UART, 2x I²C, 2x SPI, 17x GPIO, 3x PWM, 1x PCIe, 1x SAI, 2x SDIO (1x 4-bit, 1x 8-bit)
CAN2X CAN FD
Display/Touch
LCD interface1x LVDS, 1x HDMI, 1x MIPI DSI up to 4K @30 fps
Camera interface2 MIPI CSI (4-lane)
Other
Power supply5 V DC ±5 %
IO voltage1.8 V3.3 V
Power consumptionLinux running < 1 W
Temperature range-25 °C … +85 °C, ambient, non condensing
RTC (I²C)45 nA / 1ppm @25 °C
Operating systemEmbedded Linux (Yocto Distribution)
Form factor30 x 30 mm OSM Size-S
Footprint332 Pin / RM 1.25 mm
SecurityHAB Secure Boot, TrustZone, TRNG, RSA bis zu 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA bis zu 256, ECC, Secure JTAG
OSM-S i.MX8M Mini

OSM-S i.MX8M Mini

Open Standard Module™ (OSM) Quad Core with 1.6 GHz on just 30 mm x 30 mm

  • NXP i.MX8M Mini, 4 x Arm® Cortex®-A53 @1.6 GHz
  • 1 x Arm® Cortex®-M4 @400 MHz
  • 1 GB up to 4 GB LPDDR4-RAM
  • Form factor 30 mm x 30 mm

Request a quote

Accessories

  • Board
  • Evaluation Kit

Software

  • Embedded Linux (Yocto Distribution)

Technical Data

FunctionStandardOptions
Microprocessor
CPUNXP i.MX8M Mini, 4x Arm® Cortex®-A53 @1.6 GHz, 1x Arm® Cortex®-M4 @400 MHz, 2D GPU and 3D GPU
Memory
LPDDR4-RAM4 GB1 GB, 2 GB
NOR-FLASH2 MB
eMMC32 GB4 GB up to 64 GB
EEPROM8 kB On request
Communication
Ethernet1x 1 Gbit/s (RGMII)
USB2x 2.0 OTG
I/O4x UART, 2x I²C, 2x SPI, 24x GPIO, 3x PWM, 1x PCIe, 1x SAI, 2x SDIO (1x 4-bit, 1x 8-bit)
Display/Touch
LCD Interface1x MIPI DSI (4-lane), up to 1920 x 1080 @60 fps
Camera Interface1 MIPI CSI (4-lane)
Other
Power supply5 V DC ±5 %
IO voltage1.8 V3.3 V
Power consumptionLinux running < 1 W, max. < 3.5 W
Temperature range-25 °C … +85 °C, ambient, non condensing
RTC (I²C)45 nA / 1ppm @25 °C
Operating systemEmbedded Linux (Yocto Distribution)
Form factor30 x 30 mm OSM Size-S
Footprint332 Pin / RM 1.25 mm
SecurityHAB Secure Boot, TrustZone, TRNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 256, ECC, Secure JTAG
OSM-S i.MX93

OSM-S i.MX93

Open Standard Module™ (OSM) Dual Cortex with 1.7 GHz on just 30 mm x 30 mm, samples Q3/2024

  • NXP i.MX93, 2x Arm® Cortex®-A55 @1.7 GHz 
  • 1x Arm® Cortex®-M33 @250 MHz 
  • 1x Arm® Ethos™ U-65 microNPU
  • Form factor 30 mm x 30 mm, OSM-Size-S

Request a quote

Accessories

  • Board
  • Evaluation Kit 

Software

  • Embedded Software (Yocto Distrubution)

Technical Data

Function StandardOptions
Microprocessor
CPU2x Arm® Cortex-A55 @1.7 GHz, 1x Arm® Cortex®-M33 @250 MHz, 1x Arm® Ethos™ U-65 microNPU
Memory
LPDDR4-RAM1 GB512 MB up to 2 GB
eMMC4 GB8 GB up to 64 GB
EEPROM8 kB
Communication
Ethernet2x 1 Gbit/s IEEE 1588 (1x with TSN)
USB 2x 2.0 OTG
I/O4x UART, 2x I²C, 2x SPI, 10x GPIO, 3x PWM, 1x SAI, 2x SDIO (4-bit), 2x ADC
CAN2x CAN FD
Display/Touch
LCD Interface 1x MIPI DSI (4-lane), up to 1920 x 1200 @60fps, 1x LVDS (4-lane) up to 1366 x 768 @60fps
Kamera Interface 1x MIPI CSI (2-lane)
Other
Power supply5 V DC ±5 %
IO voltage1.8 V
Power consumptionTBD
Temperature range-25 °C ... +85 °C, ambient, non condensing
RTC (I²C)as an option
Operating system Embedded Linux (Yocto Distribution)
Form factor 30 mm x 30 mm OSM-S Size
Footprint 332 Pin / 1,25 mm pitch
SecurityEdgeLock® Secure Enclave
SL i.MX8M Mini

SL i.MX8M Mini

Quad Core with 1.6 GHz on just 30 mm x 30 mm

  • NXP i.MX8M Mini, 4 x Arm® Cortex®-A53 @1.6 GHz
  • 1 x Arm® Cortex®-M4 @400 MHz
  • 1 GB up to 4 GB LPDDR4-RAM
  • Form factor 30 mm x 30 mm

Request a quote

Accessories

  • Board
  • Evaluation Kit

Software

  • Embedded Linux (Yocto Distribution)
  • Optional CODESYS® SoftSPS
     

Technical Data

FunctionStandardOptions
Microprocessor
CPUNXP i.MX8M Mini, 4x Arm® Cortex®-A53 @1.6 GHz, 1x Arm® Cortex®-M4 @400 MHz, 2D GPU and 3D GPU
Memory
LPDDR4-RAM1 GBUp to 4 GB
NOR-FLASH2 MB
eMMC8 GBUp to 64 GB
Communication
Ethernet1x 1 Gbit/s
USB2x 2.0 OTG
I/O4x UART, 4x I²C, 2x SPI, 27x GPIO, 3x PWM, 1x PCIe, 1x SAI, 1x QSPI, 2x SDIO (1x 4 Bit, 1x 8 Bit)
Display/Touch
LCD interface1x MIPI DSI (4-lane), up to 1920 x 1080 @60 fps
Camera interface1 MIPI CSI (4-lane)
Other
Power supply5 V DC ±5 %
Power consumptionLinux running < 1 W, max. < 3.5 W
Temperature range-25 °C … +85 °C, ambient, non condensing
Operating systemEmbedded Linux (Yocto Distribution)
Form factor30 x 30 mm
Footprint267 Pin / RM 1.5 mm
SecurityHAB Secure Boot, TrustZone, TRNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 256, ECC, Secure JTAG
SL i.MX6ULL/UL

SL i.MX6ULL/UL

Computing power, communication and graphic on 25 mm x 25 mm

  • NXP i.MX6ULL 1x Arm® Cortex®-A7 @800 MHz
  • NXP i.MX6UltraLite 1x Arm® Cortex®-A7 @528 MHz
  • 256 MB up to 512 MB DDR3-RAM
  • Form factor 25 mm x 25 mm

Request a quote

Accessories

  • Board
  • Evaluation Kit

Software

  • Embedded Linux (Yocto Distribution)
  • Optional CODESYS® SoftSPS

Technical Data

FunctionStandard Layout ULLStandard Layout ULOptions
Microprocessor
CPUNXP i.MX6ULL 1x Arm® Cortex®-A7 @800 MHzNXP i.MX6UltraLite 1x Arm® Cortex®-A7 @528 MHz
Memory
DDR3-RAM512 MB256 MB
NAND-Flash512 MB256 MB
NOR-Flash1 MB
Communication
Ethernet2x 10/100 Mbit/s, 1x PHY included
USB2x 2.0 OTG
CAN1x CAN 2.0 B
I/O3x UART, 2x I2C, 1x SPI, 16x GPIO, 2x PWM
SDIO2x SDIO (4-bit)
Analogue3x ADC
Display/Touch
LCD interface1x RGB 24 bit up to 1366 x 768 @60 fps
Other
Power supply3.3 V ±5 %
Power consumptionmax. < 1 W, Linux running <0,5 W
Temperature range-40 °C...+85 °C, ambient, non condensing
Operating systemEmbedded Linux (Yocto Distribution)
Form factor25.5 x 25.5 mm
Footprint88 Pin CASTELLATIONS, 38 LGA Pads
Security
Secure Boot, TRNG, AES-128Secure Boot, TRNG, Tamper Detection, Secure Storage (including 32 kb Secure RAM), Cryptographic Accelerators (AES-128, DES 3DES, ARC4, MD5, SHA-1, SHA-224, SHA-256, RSA/ECDSA), Secure Debug, OTP Space
SL STM32 MP157

SL STM32 MP157

Graphics, communication and realtime control in one single chip

  • STM32MP157A, 2x Arm® Cortex®-A7 @650 MHz
  • 1x Arm® Cortex®-M4 @200 MHz
  • 256 MB up to 512 MB DDR3-RAM
  • 1x CAN 2.0 FD

Request a quote

Accessories

  • Board
  • Evaluation Kit

Software

  • Embedded Linux (Yocto Distribution)

Technical Data

FunctionStandardOptions
Microprocessor
CPUSTM32MP157A 2x Arm® Cortex®-A7 @650 MHz, 1x Arm® Cortex®-M4 @200 MHz, 3D GPU
Memory
DDR3-RAM512 MB256 MB
NAND-Flash512 MB256 MB
NOR-Flash2 MB
Communication
Ethernet1x 10/100 Mbit/s, PHY included
USB1x 2.0 Host, 1x 2.0 OTG
CAN1x CAN FD
I/O3x UART, 2x I2C, 19x GPIO, 2x PWM, 2x ADC
SDIO2x SDIO (4-bit)
Display/Touch
LCD interface1x MIPI DSI, 1x RGB 24 bit up to 1366 x 768 @60 fps
Other
Power supply3.3 V ±5 %
Power consumptionmax. < 1.25 W, Linux running <0,7 W
Temperature range-40 °C...+85 °C, ambient, non condensing
Operating systemEmbedded Linux (Yocto Distribution)
Form factor25.5 x 25.5 mm
Footprint88 Pin CASTELLATIONS, 38 LGA Pads
SecurityTrustZone, AES 256, SHA-256, MD5, HMAC, 3x Tamper Pins with 1 active, Secure RAMs, Secure Peripherals, Secure RTC, Analog true RNG, 98-bit unique ID
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